According to previous reports, the Samsung Galaxy S7 will sport the Samsung-made Exynos 8890 SoC (code named Mongoose), which is said to make its official debut in February. If a leaked benchmark result is to be believed, the processor will be a force to be reckoned with. Exynos 8890 The screenshot of the benchmark result shown above was leaked by a leakster on Chinese-speaking micro-blogging site Weibo, which is China s equivalent of Twitter. We ve come across a few benchmark results that show the performance of the Exynos 8890 SoC, which only show performance levels at par with the Exynos 7420 CPU (processor under the hood of the Samsung Galaxy S6 and the Samsung Galaxy S6 Edge). This latest benchmark score, however, shows that the 8890 will offer jaw-dropping performance like we ve never seen before. The benchmark result reveals that the Exynoss 8890 is clocked at 2.3 GHz and scored 7,000 points on the multi-core test on Geekbench, which is the highest score we ve ever seen. Add
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Tag Archives: cpu
Rumour: LG G5 to sport Snapdragon 820 CPU and custom Sony sensor
Lately, we ve been hearing a lot about upcoming flagships such as the Samsung Galaxy S7, but what about the LG G5, successor of the LG G4 (pictured below)? The first report about the LG G5 surfaced a few months back, claiming LG would not opt to outfit its next flagship with a fingerprint scanner, but an iris scanner instead. Now, a new report is claiming that the device will feature Qualcomm s Snapdragon 820 CPU and a custom Sony-made camera sensor. LG G4 with Snapdragon 820 and custom Sony sensor The new rumour comes from a post on Chinese-speaking Weibo, China s equivalent of Twitter. It claims that the LG G5 will sport Qualcomm s next generation chipset, the Snapdragon 820 CPU. This isn t at all surprising, as most high-end flagships next year will feature the said processor under the hood. Note that the LG G4 does not offer the best CPU Qualcomm currently has to offer. The chip maker s high-end chipset for 2015 is the Snapdragon 810, which is a 64-bit octa-core processor. The
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Huawei P9 said to sport new design and CPU
According to a insiders speaking to Chinese-speaking Mobile Dad, Huawei is already working on prototypes of the upcoming P9 flagship. Allegedly, the P9 bears the code name IP03, and sports a new curvy design and a fingerprint scanner on the back. It is yet to be determined if the curved design means more curves or a curved screen. It is said to sport a 5.2-inch screen (just like the Huawei P8), but with a more powerful camera a 16-megapixel rear-facing camera with optical image stabilisation. The P8 sports a 13-megapixel rear-facing camera. The insiders add that the Huawei P9 will sport the HiSilicon Kirin 950, reportedly made under TSMC s 16 nm process. It is said to sport Cortex-A72 cores, the latest GPU from ARM ( possibly the Mali T880 GPU), and a duo of image signal processors. The 950 is expected to make its debut in Q4 2015. The P9 is expected to be formally introduced in 2016. Of course, since this is anything but official, take it with a pinch of salt. However, Huawei does
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LG exec says G4 to be released next month – could sport CPU made by LG
HTC and Samsung were at MWC 2015 a days ago to lift the lid on their new flagships the HTC One M9 and the Samsung Galaxy S6 and the Samsung Galaxy S6 Edge. LG, however, did not unveil a new flagship. According to a an LG exec, their next flagship the LG G4 (LG G3 shown below) will be introduced next month. In a news conference at Barcelona, Spain, Korea Times reports head of LG Electronics handset division, Cho Juno, saying, Producing our own mobile application chips is very important. As LG Electronics has been consistent in developing these, we plan to gradually incorporate into our new models. This suggests that LG will be breaking away from its dependence on Qualcomm for processors for its smartphones. He added, We do have a lot of issues that need to be addressed, but second- and third-generation processors will be much better. He also said that the LG G4 will be radically different compared to the LG G3 its predecessor. Speaking about when LG plans to launch its next flags
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LG G Flex 2 with Snapdragon 810 CPU under the hood to make debut at CES 2015?
According to a report, LG is getting ready to lift the lid on the follow-up to the LG G Flex (pictured below) at CES 2015, which kicks off next week in the city of sin Las Vegas. The news comes to us courtesy of South Korean publication Naver. We already came across reports that claimed LG s plans of lifting the lid on the LG G Flex 2 this year, but this where this new report kicks it up a notch. According to the site, the smartphone will sport a Qualcomm Snapdragon 810 64-bit octa-core processor under the hood and LTE-A connectivity with tri-band carrier aggregation. Here s what we ve learned so far, according to past rumours. The LG G Flex 2 is said to sport a smaller screen compared to its predecessor. The original G Flex came with a 6-inch 720p screen. It s follow-up is said to sport a smaller 5-inch or 5.5-inch screen but with a higher 1080p resolution. Like its predecessor, the G Flex 2 is said to sport a self-healing rear shell. Of course, there s no way for us to confirm if t
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Report says TSMC to produce most of the A9 CPU for the iPhone 6S – Samsung will produce some of the chips
A past report claimed that Samsung would be in charge of making the A9 chip, which will be the processor under the hood of the Apple iPhone 6S and iPhone 6S Plus, with TSMC (chip manufacturer currently making CPUs for iPhones and iPads) tasked to be the backup manufacturer. A new report is saying that it s the other way around. The news comes to us courtesy to TaipeiTimes. According to the publication, Apple has given the bulk of the responsibility of making the A9 chip to TSMC, and Samsung will be the back up chip maker. So what s the reason behind this? The report says that it all comes down to yield. It seems TSMC has shown that it can produce chips more efficiently compared to Samsung. So what should we expect out of the A9 chip? If history repeats itself, not much. Of course, there s no way for us to know for sure, since Apple is yet to reveal any information on the upcoming processor. When do we get to know? Apple is expected to lift the lid on the iPhone 6S and iPhone 6S Plus i
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Samsung reportedly cooking up an Exynos CPU with a Cat. 10 LTE modem – could be on board the Galaxy S6
Qualcomm s Cat. 10 Gobi 9X45 LTE modem, which can can achieve speeds of up to 450 Mbps. This is around a half faster that high-end the Cat. 6 LTE modems. It seems Samsung is cooking up a competitor to Qualcomm s Cat. 10 LTE modem. The news comes to us courtesy of Korean-speaking Naver. According to the site, the Korean tech giant is cooking up a an Exynos processor with a tri-band Cat. 10 LTE modem. The best news about this modem is that this chip will be on board the Samsung Galaxy S6. The S6 is said to be available in two versions. One will sport a Qualcomm Snapdragon 810 processor, while the other would sport an Exynos CPU under the hood. Of course, since this is an unconfirmed report, take it with a pinch of salt. Do you think the Samsung Galaxy 6 will sport an Exynos CPU with a Cat. 10 LTE modem? Let us know what you think through a comment on our Phones LTD Facebook page.
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HTC Desire 620 with 64-bit CPU to be available in Asia this December
HTC has lifted the lid on the Desire 620 in Taiwan it s home country, Chinese-speaking ePrice reports. The new smartphone will be available in Asia in two versions. The Desire 620 comes with a Qualcomm Snapdragon 410 64-bit quad-core processor with each core clocked at 1.2 GHz and LTE support, while the Desire 620G comes with a MediaTek MT6592 octa-core processor with each core clocked at 1.3 GHz but no LTE support. Apart from the chipsets mentioned above, everything else is the same. The Desire 620 and 620G both sport a 5-inch screen with a resolution of 720 x 1280 pixels, two SIM card slots, an 8-megapixel rear-facing camera, a 5-megapixel front-facing camera, 8 GB of internal storage, a microSD card slot, 1 GB of RAM, and a 2100 mAh battery. Both run Android 4.4 (KitKat) with HTC s Sense 6 UI slapped on top. The Desire 620 has been launched in Taiwan on the 1st of December, while the Desire 620G will be launched in the country in mid-December. HTC is selling the 620 for 6,999 TWD (
http://news.phonesltd.co.uk/phones/htc/htc-desire-620-with-64-bit-cpu-to-be-available-in-asia-this-december/
SM-G5309W with 64-bit CPU approved in China
A Samsung-made device with model number SM-G5309W has been approved by TENAA, China s equivalent of the US FCC. This 5-inch smartphone is the Korean tech giant s first smartphone sporting Qualcomm s 64-bit Snapdragon 410 processor. The SM-G5309W is not a high-end device. Aside from the 64-bit processor 1.2GHz quad-core processor with an Adreno 306 GPU, it sports a 5-inch screen with a resolution of 540
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